1. What does knot making refer to? The fabrication methods include thermal diffusion, ion implantation, epitaxy, laser and high frequency electric implantation.
2. How is the dirty film caused?
3. How is the pitting caused?
4. How is the oil pollution caused?
5. How is over-engraving caused?
6. How is the black border caused?
7. How is drug residue caused?
8. How is locus coeruleus caused?
9. How is porous silicon made?
10. How are roller marks caused?
Cause: There is liquid residue or other contamination on the silicon wafer; the roller at the ACD is dirty;
11. What causes white spots or plaques on the surface of the silicon wafer after PECVD?
12. Why is it necessary to carry out air shower before entering the workshop?
13. Why should I wear clean clothes, masks and gloves?
14. Why should the dressing of the cleaning machine be changed?
15. How often do you usually change the medicine?
16. Why is the inside of the cleaning machine made of plastic without metal?
17. Why can't the roller of the cleaning machine be wiped with alcohol?
18. Why should water be added first and then medicine be added when cleaning the acid soaking tank of the machine?
19. Why can't the belt of the loading and unloading machine be wiped?
Cause: Generally, the belt is purged with an air gun. If the belt is wiped manually, it will be subject to stress under external force. This is because the belt is slightly deformed, and the cell will have poor belt printing.
20. Why is it necessary to control the storage time (Q-time) of each process of the cell?
21. Why change the filter element?
22. Why does the cleaning machine run fake films?
23. How to select the monitoring film for testing square resistance?
24. Why does the fake film run by the second machine spread?
Reason: Diffusion causes the following reaction in the silicon wafer: 4POCL3 + 5O2 = 2P2O5 + 6CL225
. Why does the workshop measure the cleanliness?
26. Why does the feeding section of the etching machine spray water film on the battery?
27. Why test for hydrophilicity? Test the anti-PID effect of the hydrophilic monitoring cell in the later period.
28. Why is the insulation resistance tested in the etching process?
29. What is a semiconductor PN junction?
30. Does the screen printing speed affect the printing effect? The flatness of the printing is deteriorated, and the calabash-shaped grid line is easily caused. In a certain range, the printing speed is increased, the height of the grating line is increased, and the width of the grating line is reduced.
31. What is the effect of paste viscosity on printing effect? If the viscosity of the slurry is too large, it will lead to poor ink penetration, and will produce orange peel and small holes. Within the permitted range, the smaller the viscosity of the slurry, the better.
32. The relationship between screen pressure and spacing? Because when the pressure is high, the more the scraper protrudes from the place where it contacts the screen. If the spacing is small, the pressure on the silicon wafer will increase, and it is easy to cause debris. The two parameters can not be changed independently, otherwise it will affect the printing quality and increase the fragmentation rate.