Global Silicon Wafer Production Capacity Shrinks for the First Time in Nearly a Decade

(1) The development of

the global silicon wafer industry in 2025 In 2025, the global photovoltaic silicon wafer market contracted for the first time in nearly ten years, and the production capacity and output fell synchronously. The industry has entered the stage of deep adjustment from high-speed expansion. By the end of 2025, the global total production capacity of silicon wafers will be approximately 1,318.9 GW, representing a year-on-year decrease of 5.4%; the output will be approximately 742.3GW, representing a year-on-year decrease of 7. From the perspective of production layout, the absolute dominant position of mainland China in the photovoltaic silicon wafer sector will remain stable in 2025, and the core competitive advantage will not be fundamentally shaken. By the end of 2025, the silicon wafer production capacity of Chinese mainland enterprises reached 1271.1GW . Accounting for 96% of the world's total production capacity.

2010-2025 Global silicon wafer production (unit: GW)

The scale of silicon wafer industry in mainland China has shown negative growth . By the end of 2025, the production capacity of silicon wafers in mainland China is about 1271.1GW, which is 5.8% lower than that of the previous year, accounting for 96.4% of the global production capacity of silicon wafers; The output was about 719.3GW, down 7.3% year on year. Accounting for 96% of global silicon wafer output.

2010-2025 China's silicon wafer production capacity/output (unit: GW)

(III) Characteristics

of industrial development The pace of silicon wafer thinning tends to be flat. In 2025, the average thickness of P-type monocrystalline silicon wafers will remain unchanged at about 150 μm; the average thickness of N-type silicon wafers for TOPCon batteries will be 130 μm, and the average thickness of silicon wafers for heterojunction (HJT) batteries will be 110 μm, both of which will be the same as in 2024. The average thickness of the silicon wafer used for the xBC cells is 135 μm.

Rectangular pieces become the mainstream of the market. According to the , the market share of rectangular pieces will increase rapidly until 2025. The market share of rectangular wafers has risen to 48.

Tungsten wire for silicon wafer cutting has basically replaced high-carbon steel wire. According to the latest data of China Photovoltaic Industry Development Roadmap (2025-2026) issued by China Photovoltaic Industry Association, in 2025, high-carbon steel wire has been basically replaced by tungsten wire. (IV) Industry Development Trend

While N-type TOPCon, xBC and HJT silicon wafers occupy the mainstream market, Some leading enterprises in the industry have begun to lay out N-type silicon wafers for tandem batteries and < a href = "https://www.databm.2025 September 2008." The State Administration of Market Supervision and Administration and the Standardization Administration of the People's Republic of China jointly issued the draft of the mandatory national standard for soliciting opinions on the Energy Consumption Quota for Unit Products of Silicon Single Crystal, which guides the silicon single crystal industry to speed up energy conservation, carbon reduction, quality improvement and efficiency enhancement through the energy consumption management mechanism of classification and rigid constraints.