, Jingang Photovoltaic released a record of investor activity relations, and the company received 17 institutions such as Guojin Securities, China-Thailand Securities and Ping An Fund on the same day.
The company said that in June 2021, the company transformed and upgraded its business, laid out heterojunction photovoltaics, and successively built 1.2G W and 4.8G W high-efficiency heterojunction cells and components projects in Wujiang and Jiuquan. Among them, two single-sided microcrystalline production lines of Suzhou Wujiang 1.2G W heterojunction project are in continuous and stable production; for Jiuquan 4.8GW heterojunction project, the double-sided microcrystalline production lines that have entered the site have entered the stage of commissioning and mass production climbing.
In terms of cost, the company has fully used 130 μm silicon wafers for mass production at the beginning of 2023; silver-clad copper products have completed internal verification and have the conditions for mass production application. In terms of cell efficiency, the average efficiency of single-sided microcrystalline heterojunction cells in Wujiang is 25%, and the average efficiency of double-sided microcrystalline heterojunction cells in Jiuquan is 25.3%. There is room for further improvement in efficiency this year.
At present, the thickness of silicon wafers used for mass production in Wujiang and Jiuquan production lines is mainly 130 μm, while the company has the ability to produce 110 μm silicon wafers. In the future, when there is no problem in the supply of silicon wafers and customers can accept thinner silicon wafers, the company will import thinner silicon wafers. The company's future goal is to achieve 100 μm silicon wafer applications.
In addition, all the silicon wafers used by the Company at the present stage come from purchased finished silicon wafers. From the perspective of cost reduction, if the future demonstration is clear and the slicing process and yield can meet the cost budget requirements, the Company will consider to achieve thinner silicon wafer slicing by looking for OEM slicing from manufacturers in the future, and to solve the problem of silicon rod source while looking for OEM slicing. In terms of
cost, the company will reduce the cost from the following aspects: 1. Silicon wafer. The company has the ability to use silicon wafers with thickness of 120 μm and 110 μm for mass production; 2. Silver-clad copper. The company has the conditions for mass production of silver-coated copper paste with a ratio of 50:50, which can reduce silver consumption; 3. Localization substitution. The company is looking for domestic raw and auxiliary materials to replace the original imported materials; 4, others. The company pays close attention to the progress of technologies that are conducive to cost reduction, such as no main grid technology, narrow line width technology, copper plating, etc.
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