The production line of Yujing Silicon Wafer Project has been put into production and sold in March.

On April 19, Yujing said on the interactive platform for investors that with the further thinning of the thickness of silicon wafers, the advantages of the company's wire cutting machine products in terms of large size and thinness will be revealed. In order to adapt to the future development trend of photovoltaic industry , the company has launched HJT and Topcon special wire cutting machines for 210 mm half and 182 mm thin sheets. Customers have achieved stable mass production of 210 mm half wafers and 182 mm thin wafers by using the company's special wire cutting machine, and gradually pushed forward to thinner silicon wafer thickness. The company's silicon wafer project production line has been put into production and achieved sales in March 2023. At present, the project is progressing smoothly, and the follow-up will be steadily promoted depending on the situation.