On January 20, China Building Materials Co., Ltd. issued an overseas regulatory announcement, announcing that it intends to issue bonds of science and technology innovation companies (the first issue) to professional investors in 2026, with a scale of no more than 2 billion yuan (including 2 billion yuan). All the funds raised by this bond will be used to repay interest-bearing debts, so as to further optimize the company's debt structure and enhance financial stability.

The issuance of technology innovation corporate bonds is an important measure of China's building materials in the capital market. The announcement shows that the total registered amount of the bond is 20 billion yuan. The fund raised will be used to repay interest-bearing debts, which will help the company optimize its debt maturity structure and reduce its financial costs, thereby enhancing its ability to resist risks and achieve sustainable development.
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