Recently, the board of directors of Shangfeng Cement has approved the technical renovation and expansion project of high-precision semiconductor packaging substrate production line with a total investment of 600 million yuan, which marks the steady acceleration of the company's new quality business development. In March
this year, Shangfeng Material increased its capital to control Meiqi Circuit, a semiconductor packaging substrate company located in Jiangmen, Guangdong Province, and integrated the packaging substrate related business of Shenzhen Zhijin Electronics and Huizhou Manufacturing Base. Meiqi's circuit products cover Mini/Micro LED, MEMS, sensor, storage, RF and other major types. The core team has more than 20 years of industry experience and outstanding technology research and development capabilities. Up to now, it has more than 40 patents, including more than 10 invention patents, and has mature packaging substrate technology and product research and development capabilities.
The new investment of 600 million yuan is planned to be carried out in two phases. The first phase of the project is to upgrade the existing production line, and the second phase of the project is to build a new high-precision packaging substrate production line for the high-end market layout to upgrade the products to high-end ultra-thin substrate products. After the project is completed, the production capacity of the packaging substrate in Jiangmen Base can reach 16000 square meters per month, and the production capacity of the packaging substrate in Jiangmen Base can reach 100 square meters per month. The total production capacity of Meiqi Circuit Packaging Substrate, including Huizhou Base, can reach 26000 square meters per month.
This technical transformation and expansion project is an important part of the total investment plan formulated by the board of directors in the year, which is closely in line with the company's development strategy of accelerating the implementation of new quality business.
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