August 25, 2023HJT Heterojunction & & Laminate Technology Industry Summit was held in Shanghai. Zhou Bo, R & D Director of High Measurement Co., Ltd., attended the summit and shared the R & D and application results of the company's cutting technology with the theme of "One Step Ahead-Exploration of High Measurement Silicon Wafer Cutting Technology", and highlighted the various paths of half-rod processing and the R & D and industrialization process of ultra-thin half-wafer technology.
HJT is driving into the fast lane of reducing costs and increasing efficiency, and is expected to enter 10GW scale production in 2023. In view of this industry trend, Gaoyu shares give full play to the advantages
of collaborative research and development and technology closed-loop of "cutting equipment + cutting consumables + cutting technology". The cutting technology route of "half rod and half slice" has been innovatively introduced, and four different half-rod processing modes have been introduced for the half-rod processing link, namely, the mode of "truncation-squaring-middle cutting-grinding", the mode of "truncation-squaring + middle cutting-grinding", the mode of "truncation-squaring-grinding-middle cutting-grinding", and the mode of "front sequence-squaring 1-squaring 2-truncation". The technology of the four modes has reached a mature level, which can provide customers with personalized and customized services according to the cutting application needs of different customers.
First step, the R & D industry launched 60 μm ultra-thin half-chip, TTV, line marks and other technical indicators basically reached the level of mass production of silicon wafers in the same period, so that silicon wafers do not become the short board of HJT battery technology application. At the same time, the company continues to promote the exploration of thin slice and thin line, support the platform slicer for future technology expansion, match the corresponding cutting process, ensure a higher half-slice yield, and help the industry reduce costs and increase efficiency. On the tool side, the company's 30 μm diamond wire is currently being tested on the client side. Taking the 100 μm half piece with mass production conditions as an example, under the current silicon material price, the cost of a single watt battery can be reduced by 0.003 yuan/w for every 2 μm reduction in the diameter of the diamond wire, and the number of silicon wafers can be increased by 1.6%.
Take the first step to build the digital intelligence ecology of photovoltaic slicing factories, realize low-cost silicon wafer manufacturing, and make full preparations for HJT mass production. Based on the real-time sharing of big data of "equipment, tools and processes", the company can quickly realize the closed-loop technology and promote research and development in reverse, so as to ensure that the company always takes the lead in predicting industry demands and pre-researching new products.
Next, the company will continue to promote the iterative research and development of diamond wire thinning, the improvement of cutting equipment performance and the transformation and upgrading of intelligent manufacturing, give full play to the advantages of joint research and development and closed-loop technology, accelerate the expansion of production capacity of superior chips, continuously create value for customers, and inject momentum into the industry to reduce costs and increase efficiency.
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